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Second generation of optical IC-backside protection structure

机译:第二代光学IC背面保护结构

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摘要

In a system-on-chip (SoC) technology, the secret data such as cryptographic keys are stored on the chip. Accordingly, the system must be able to protect confidential data from unauthorized access. Despite the existence of numerous countermeasures that are implemented on the frontside of the chip, a lack of backside protection makes the integrated circuit (IC) vulnerable to physical and optical attacks. This paper aims to elaborate further on a backside protection structure that had proven as a valuable enhancement in the field of hardware security. The here presented second-generation of a backside protection mechanism provides solutions to increase the amount of monitoring data that can be used to monitor a backside attack. Through analyzing the obtained data by artificial intelligence (AI) approach, we can get detailed and accurate information about the IC backside and IC structures. Gaining this information helps to improve the protection mechanism. Furthermore, this study proposes to create a random roughness on the silicon back surface before coating a protection layer. A concept to use such an inhomogeneous surface in combination with the presented protection mechanism and its AI data to realization physical unclonable functions (PUF) is introduced, realizing a secure key generation or authentication.
机译:在片上系统(SOC)技术中,诸如加密密钥之类的秘密数据存储在芯片上。因此,系统必须能够保护机密数据免受未经授权的访问。尽管存在在芯片前面实施的众多对策,但缺乏背面保护使得集成电路(IC)容易受到物理和光学攻击。本文旨在在背面保护结构上进一步详细说明,这些结构已被证明是硬件安全领域的宝贵增强。这里介绍了第二代背面保护机制,提供了增加可用于监控背面攻击的监控数据量的解决方案。通过通过人工智能(AI)方法分析所获得的数据,我们可以获得有关IC背面和IC结构的详细和准确的信息。获得此信息有助于改善保护机制。此外,该研究提出在涂覆保护层之前在硅背面上形成随机粗糙度。介绍了使用这种非均匀表面与所提出的保护机制及其实现物理不可渗透功能(PUF)组合使用这种不均匀表面的概念,实现了安全的密钥生成或认证。

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