首页> 外文会议>IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits >Robust Forward Gate Bias TDDB Stability in Enhancement-mode Fully Recessed Gate GaN MIS-FETs with ALD Al2O3Gate Dielectric
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Robust Forward Gate Bias TDDB Stability in Enhancement-mode Fully Recessed Gate GaN MIS-FETs with ALD Al2O3Gate Dielectric

机译:具有ALD Al2O3Gate介电层的增强模式全隐式GaN GaN MIS-FET的稳健前向栅极偏置TDDB稳定性

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In this work, we have demonstrated the robustness of the forward gate bias time-dependent dielectric breakdown (TDDB) stability in fully recessed gate GaN Metal-Insulator-Semiconductor Field-Effect Transistors (MIS-FETs) with an atomic layer deposited (ALD) Al2O3as a gate dielectric. First, an enhancement-mode (E-mode) characteristic with VTH~ +1V is demonstrated in a fully recessed gate GaN MIS-FET with a 25-nm ALD Al2O3gate dielectric layer. Second, the low gate leakage is observed and the device shows no gate breakdown till 15V at room temperature. Last, an operating gate voltage of 7V (exponential law) or 8.8V (power law) can be extrapolated while considering 1 % of failures for Wg=36mm at 150°C after 10 years, showing a promising forward gate TDDB stability.
机译:在这项工作中,我们证明了在沉积有原子层(ALD)的全凹入式栅极GaN金属-绝缘体-半导体场效应晶体管(MIS-FET)中,正向栅极偏置随时间变化的介电击穿(TDDB)稳定性的鲁棒性。铝 2 Ø 3 作为栅极电介质。首先,具有V的增强模式(E模式)特性 TH 在具有25nm ALD Al的全凹栅GaN MIS-FET中证明了约+ 1V 2 Ø 3 栅极介电层。其次,观察到较低的栅极泄漏,并且该器件在室温下直至15V都没有栅极击穿现象。最后,可以推断出7V(指数定律)或8.8V(功率定律)的工作栅极电压,同时考虑了10年后在150°C下Wg = 36mm的故障发生率为1%的情况,这显示出有希望的正向栅极TDDB稳定性。

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