Inverse Problem Approach for the Quantification of Adhesive Layer Cohesive Defects using Wavelet Spectral Finite Element Bonded Joint Model

摘要

A novel wavelet spectral finite element model based inverse problem approach is proposed to quantify the cohesive damages in a single lap joint assembly. Cohesive damages, which relate to the degradation of the mechanical properties of the adhesive layer, significantly increase the peel and shear stresses and cause the debonding of the joint prematurely. Hence, the detection and quantification of the cohesive damages is highly significant. The proposed method has significantly higher computational efficiency compared to the conventional finite element based procedures, and it is able to quantify the cohesive damages with high accuracy. The capabilities of the proposed inverse problem approach is demonstrated through a numerical case study.