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Design And Prospect Of New Splicing Heterogeneous Chips

机译:新拼接异构芯片的设计与展望

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The new heterogeneous chip will become the development direction of the future chip field, which includes the existing chip computing capabilities, and combines branches of many different computing fields such as quantum computing and DNA biometrics computing. In particular, the great potential of such heterogeneous computing is pointed out, especially if the channel capacity expansion of communication is considered, the implementation of the three-dimensional heterogeneous stacked chip can be further considered. In this paper, a novel splicing chip architecture will be proposed to implement this heterogeneous chip. Its idea comes from the brain-like computing chip architecture, but it has been further developed in this article. The application potential of the splicing architecture in the new heterogeneous chip is discussed in depth from the perspective of connectivity and redundancy tolerance.
机译:新的异构芯片将成为未来芯片字段的发展方向,包括现有的芯片计算能力,并组合许多不同计算领域的分支,例如量子计算和DNA生物识别计算。特别地,指出这种异构计算的巨大潜力,特别是如果考虑通信的信道容量扩展,则可以进一步考虑三维异构堆叠芯片的实现。本文将提出一种新颖的拼接芯片架构来实现这种异构芯片。它的想法来自大脑计算的芯片架构,但它已进一步开发在本文中。从连通性和冗余公差的角度深入地讨论了新的异构芯片中拼接架构的应用势。

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