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Detecting high concentration hydrogen with nanoporous palladium supported by anodic aluminum oxides

机译:用阳极铝氧化物支撑的纳米多孔钯高浓度氢气

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Hydrogen-induced blistering of dense Pd films upon absorption of high concentration hydrogen is one of the big problems for hindering wide application of Pd-film hydrogen sensors fabricated on traditional wafers [1, 2]. Considerable stressing in the Pd film or stress mismatch at the interface between the Pd film and the supporting substrate is believed to cause such a failure in detecting high concentration hydrogen. In this work, we report hydrogen sensing properties of highly stable nanoporous Pd sensors fabricated on anodic aluminum oxides (AAOs). Aluminum film was deposited onto Ti-coated n-type Si wafers by e-beam evaporation. Through anodization of the Al film in 0.3 M oxalic acid, AAO substrate with pore diameters around 60 nm and pore lengths about 2.5μm was prepared. Nanoporous Pd films with a thickness of 45 nm or 5 nm were deposited, via r. f. sputtering, onto the AAO substrate by using Ni (2 nm in thickness) as a transition layer. The nanoporous Pd film sensors were put into a flask chamber. Resistive testing of the sensors under different concentrations of hydrogen gas was conducted with a Keithley 2000 multimeter. For comparison, dense Pd film sensors supported by silica wafers were also tested. Fig. 1 shows SEM morphologies of a dense Pd film and nanoporous Pd films. All of the sensors are sensitive to hydrogen gas at concentrations above 0.25% (Fig. 2). But the sensors made from the dense Pd films fail, by showing irreversible recovery (a sign of blistering) after switching off the hydrogen gas, at hydrogen concentrations above 1.5% for the 45 nm film and 3% for the 5 nm film. This once again proves that a blistering of dense Pd films will result in a failure to detect high concentration hydrogen. Whereas, the nanoporous Pd film sensors can detect much higher hydrogen concentrations up to 10%. At hydrogen concentrations above 1%, more than 20% of sensitivity (variation of film resistance upon absorption of H) can be obtained with the thicker nanoporous film (45 nm). At H{sub}2 concentrations above 2%, it only needs less than 30 seconds for the thicker nanoporous Pd film (45nm) to have a 10% variation of resistance (Fig. 3). With the film thickness being thinned down to 5 nm, the nanoporous film sensor has a much quicker response (Fig. 4). Typical response time of the thinner nanoporous Pd film (5nm) is less than 1 minute at H{sub}2 concentrations above 2%. And the response time decreases from 30 seconds at 4% H{sub}2 to 15 seconds at 10% H{sub}2.
机译:在高浓度氢吸收时,致密Pd膜的致密Pd膜的起泡是妨碍在传统晶片上制造的PD膜氢传感器的广泛应用的重要问题之一[1,2]。在Pd膜和支撑基板之间的界面处的Pd膜或应力失配中的显着应力相当强调,以引起检测高浓度氢的这种失败。在这项工作中,我们报告了在阳极铝氧化铝(AAOS)上制造的高度稳定的纳米孔PD传感器的氢感性。通过电子束蒸发将铝膜沉积在Ti涂覆的N型Si晶片上。通过在0.3M草酸中的Al膜的阳极氧化,制备具有孔径约60nm的AaO底物,并制备约2.5μm的孔长度约2.5μm。沉积厚度为45nm或5nm的纳米孔Pd膜,通过R沉积。 F。通过使用Ni(厚度为2nm)作为过渡层,溅射在AaO底物上。将纳米多孔Pd膜传感器放入烧瓶室中。用Keithley 2000万用表进行不同浓度的氢气在不同浓度的氢气下的电阻测试。为了比较,还测试了二氧化硅晶片支撑的致密PD膜传感器。图。图1显示了致密PD膜和纳米多孔Pd膜的SEM形态。所有传感器对0.25%以上浓度的氢气敏感(图2)。但是,由致密的Pd膜制成的传感器通过显示在切断氢气后的不可逆恢复(起泡的迹象),在45nm膜上以高于1.5%的氢气浓度和5nM膜的3%。这再次证明了致密Pd膜的起泡将导致未检测高浓度的氢气。虽然,纳米孔Pd膜传感器可以检测高达10%的更高氢浓度。在高于1%以上的氢浓度下,通过较厚的纳米多孔膜(45nm)可以获得超过20%的灵敏度(在吸收H)时膜阻力的变化。在2%以上的H {亚} 2浓度下,较厚的纳米孔Pd膜(45nm)仅需要少于30秒,具有10%的电阻变化(图3)。薄膜厚度变薄至5nm,纳米多孔膜传感器具有更快的响应(图4)。较薄的纳米孔Pd膜(5nm)的典型响应时间小于2%以上的H {Sub} 2浓度的1分钟。并且响应时间在10%h {sub} 2下从4%h {sub} 2至15秒降低。

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