A Novel LTCC-based 3D Packaging for Ultrawideband RF Applications

摘要

This paper realized high-density stereo packaging based on LTCC by researching the 3D integration method of integrated devices in double-sided cavities on an independent LTCC substrate, which satisfied the requirements of integration and airtightness of multiple chips, solved the problem of high-density stacking integration of chips in broadband RF system, and increases the integration density of functional units by more than doubled. The stack planning and interconnection structure design of the board solve the contradiction between ultrawideband (0.1-40GHz), low insertion loss, high density and low cost. Finally, the design and optimization of the multi-temperature gradient assembly process ensured the engineering realization of the package and completed a small batch trial production, the size of an individual product is 30mm×30mm×5.6mm, and the weight is 16g.