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A Novel HV-NPN ESD Protection Device with Buried Floating P-Type Implant

机译:带有埋入浮动P型植入物的新型HV-NPN ESD保护装置

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A novel high voltage NPN (HV-NPN) device with buried floating P-type (BFP) implant at collector side was developed for electrostatic discharge (ESD) protection in a 130nm low cost high voltage CMOS technology. The characteristics of the novel HV-NPN device using transmission line pulse (TLP) measurements show that a second snapback enhances the failure current and reduces the on-resistance at a certain high current levels. The device mechanism is illustrated with technology computer aided design (TCAD) simulation results.
机译:开发了一种新颖的高压NPN(HV-NPN)器件,该器件在集电极侧具有掩埋浮置P型(BFP)植入物,用于采用130nm低成本高压CMOS技术进行静电放电(ESD)保护。使用传输线脉冲(TLP)测量的新型HV-NPN器件的特性表明,在一定的高电流水平下,第二次骤回会增强故障电流并降低导通电阻。通过技术计算机辅助设计(TCAD)仿真结果说明了该设备机制。

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