Compliance analysis of a parallel leaf-spring carrying mechanism

摘要

In order to realize high precision wafer positioning and transferring in a lithography machine, a novel parallel leaf-spring carrying mechanism (PLCM) was investigated in this paper using a compliance-matrix based approach. With the aid of screw theory, eigenscrew decomposition method is used to compute the eigencompliance, eigenscrew, eigenpith, compliant axis and compliance center, as well as to interpret physical property of compliance matrix. In addition, the effects of the leaf-spring parameters and flexible arm parameters on the compliance characteristics are further revealed, and the optimized results of geometrical parameters are obtained. It can therefore be concluded that the methods used for compliance analysis can be used as a reference for the analysis and design of a complex parallel compliant mechanism.