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Qubit Device Integration Using Advanced Semiconductor Manufacturing Process Technology

机译:使用先进的半导体制造工艺技术进行Qubit器件集成

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Quantum computing's value proposition of an exponential speedup in computing power for certain applications has propelled a vast array of research across the globe. While several different physical implementations of device level qubits are being investigated, semiconductor spin qubits have many similarities to scaled transistors. In this article, we discuss the device/integration of full 300mm based spin qubit devices. This includes the development of (i) a 28Si epitaxial module ecosystem for growing isotopically pure substrates with among the best Hall mobility at these oxide thicknesses, (ii) a custom 300mm qubit testchip and integration/device line, and (iii) a novel dual nested gate integration process for creating quantum dots.
机译:量子计算对某些应用的计算能力呈指数级增长的价值主张推动了全球范围内的大量研究。在研究器件级量子位的几种不同物理实现方式时,半导体自旋量子位与定标晶体管有许多相似之处。在本文中,我们讨论了完整的基于300mm自旋qubit器件的器件/集成。这包括(i) 28 Si外延模块生态系统,用于以这些氧化物厚度生长具有最佳霍尔迁移率的同位素纯衬底,(ii)定制的300mm量子位测试芯片和集成/器件线,以及(iii)用于创建量子点的新型双嵌套栅集成工艺。

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