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Using Full Trace Analytics to Simplify Root Cause Analysis

机译:使用完整的跟踪分析来简化根原因分析

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In semiconductor manufacturing, traditional root cause analysis using FDC summary data is not always effective in solving complex issues, especially when the defect signals are too subtle to detect. Full trace analytics enables the discovery of these hidden signals allowing fab engineers to accurately pinpoint the root causes of yield-impacting issues. This paper highlights several use cases illustrating how advanced full trace analytics can help not only in providing accurate results, but also in simplifying the root cause analysis process and reducing time-to-root-cause.
机译:在半导体制造中,使用FDC摘要数据的传统根本原因分析在解决复杂问题方面并不总是有效的,特别是当缺陷信号太微妙时才能检测到。完整的跟踪分析使得能够发现这些隐藏信号,允许Fab工程师准确地确定产生影响问题的根本原因。本文突出了若干用例,说明高级的全跟踪分析如何帮助提供准确的结果,也可以帮助简化根本原因分析过程并减少根到根的原因。

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