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The role of the bottom and top interfaces in the 1st reset operation in HfO2 based RRAM devices

机译:在基于HfO 2 的RRAM器件的1 st 复位操作中,底部和顶部接口的作用

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In this work, the increase on the conductive filament conductivity during the 1st Reset operation, by using the incremental step pulse with verify algorithm, in HfO2 based 1T1R RRAM devices is investigated. A new approach is proposed in order to explain the increase of conductivity by highlighting the crucial roles played by both metal-oxide interfaces. The top metal-oxide interface (HfO2-x/TixOy) plays a crucial role in the forming operation by creating a strong gradient of oxygen vacancies in the hafnium oxide layer. The bottom metal-oxide interface (TixOyNz/HfO2-x) also creates oxygen vacancies, which strengthen the conductive filament tip near to this interface at the beginning of the 1st Reset, leading to the reported conductivity increase. After the 1st Reset operation the conductive filament stabilizes at the bottom interface suppressing this behavior in the subsequent reset operations.
机译:在这项工作中,在基于HfO 2 的1T1R RRAM器件中,通过使用带有验证算法的增量步进脉冲,在1 st 重置操作期间,导电细丝电导率的增加为调查。提出了一种新方法,以通过突出两个金属氧化物界面所起的关键作用来解释电导率的增加。顶部金属氧化物界面(HfO 2-x / Ti x O y )在形成过程中起着至关重要的作用,氧化ha层中氧空位的梯度。底部金属氧化物界面(Ti x O y N z / HfO 2-x )也产生氧气空位,这会在1 st 重置开始时加强靠近此界面的导电细丝尖端,导致报告的电导率增加。在1 st 重置操作之后,导电丝会稳定在底部界面处,从而抑制了后续重置操作中的这种行为。

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