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Characterization of the interface-driven 1st Reset operation in HfO_2-based 1T1R RRAM devices

机译:基于HfO_2的1T1R RRAM器件中接口驱动的第一复位操作的特性

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In this work, the increase on the filament conductivity during the 1st Reset operation, by using the incremental step pulse with verify algorithm, is investigated in HfO2-based 1T1R RRAM devices. A new approach is proposed in order to explain the increase of conductivity by highlighting the crucial roles played by both metal-oxide interfaces. The top metal-oxide interface (HfO2-x/TixO(y)) plays a role in the forming operation by creating a strong gradient of oxygen vacancies in the hafnium oxide layer. The bottom metal-oxide interface (TixOyNz/HfO2-x) also creates oxygen vacancies, which strengthen the conductive filament tip near to this interface at the beginning of the 1st Reset, leading to the reported conductivity increase. After the 1st Reset operation the conductive filament stabilizes at the bottom interface suppressing this behavior in the subsequent reset operations. By modifying the programming parameters and the temperature, it was confirmed a constant current increase of about 9 mu A during the 1st Reset regardless the operation conditions imposed.
机译:在这项工作中,在基于HfO2的1T1R RRAM器件中,通过使用带有验证算法的增量步进脉冲,研究了第一次复位操作期间灯丝电导率的增加。提出了一种新方法,以通过突出两个金属氧化物界面所起的关键作用来解释电导率的增加。顶部金属氧化物界面(HfO2-x / TixO(y))通过在氧化f层中形成一个很强的氧空位梯度,在成型操作中发挥作用。底部金属氧化物界面(TixOyNz / HfO2-x)还会产生氧空位,从而在第一次复位开始时加强靠近该界面的导电细丝尖端,导致报告的电导率增加。在第一次复位操作之后,导电丝会稳定在底部界面处,从而抑制了后续复位操作中的这种行为。通过修改编程参数和温度,可以确定在第一次复位期间无论施加何种工作条件,恒流都将增加约9μA。

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