New market trend in CMP equipment/material for the “More than Moore” era

摘要

As the planarization technology for multilayers develops to advance the miniaturization of the semiconductor devices, the market of chemical mechanical planarization (CMP) equipment/materials continues to expand in pursuit of “More Moore.” In particular, the demand of for CMP technology for the miniaturization has increased owing to the upgrading of lithography technology, and the market has expanded. We consider that CMP market size correlates with developments in lithography. Among lithography generation changes, the advances in miniaturization, multilayer device packaging, and mounting boards are remarkable. In the future, more advanced packaging technology is required for Big Data, the Internet of Things (IoT), 5G communication, artificial intelligence (AI), and autonomous driving. To achieve the miniaturization of packaging technology, the crucial points are as follows: (i) it is necessary to use a stepper for lithography technology, and (ii) the stacking substrate must be accurately connected with a narrow pitch. We investigate the necessity of CMP technology on the basis of trends and future predictions.