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32GHz resonant-fin transistors in 14nm FinFET technology

机译:采用14nm FinFET技术的32GHz谐振鳍式晶体管

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Monolithic integration of microelectromechanical resonators in IC technology has been explored extensively over the past few decades in the effort to achieve on-chip clocks, RF filters, and physical, chemical, and biological sensors. Various approaches for resonator integration, actuation, and sensing have been proposed and demonstrated, targeting high Q and high frequency performance [1]. These include the “MEMS-last” approach with low temperature materials deposited on complete CMOS chips [2,3], and “MEMS-in-the-middle” in which resonators are defined with post-processing of the front end and back end materials of the IC stack [4]. These methods require additional processing and packaging steps that make frequency scaling challenging and may limit resonator Q. Meanwhile, in the case of monolithically integrated MEMS resonators, transistor sensing can be used to enhance transduction efficiency and reduce parasitics, which can prohibit 2-port detection for high frequency resonance [5]. In this work, we introduce the Resonant Fin Transistor (RFT) fabricated in GLOBALFOUNDRIES 14nm FinFET technology, leveraging the vertical 3D geometry of FinFETs (Fig. 21.3.1) to efficiently confine, drive, and sense acoustic vibrations in the solid (unreleased) CMOS stack with no post-processing or custom packaging. We demonstrate 32GHz resonators with Q~49,000.
机译:在过去的几十年中,为实现片上时钟,RF滤波器以及物理,化学和生物传感器,已经广泛地探索了微机电谐振器与IC技术的单片集成。已经针对高Q和高频性能提出并展示了各种用于谐振器集成,致动和感测的方法[1]。这些包括“低温-MEMS”方法,将低温材料沉积在完整的CMOS芯片上[2,3],以及“中间-MEMS”,其中谐振器通过前端和后端的后处理来定义IC堆栈的材料[4]。这些方法需要额外的处理和封装步骤,这使频率缩放变得困难,并可能限制谐振器Q。同时,在单片集成MEMS谐振器的情况下,可以使用晶体管感测来提高转换效率并减少寄生现象,这可能会阻止2端口检测用于高频共振[5]。在这项工作中,我们介绍采用GLOBALFOUNDRIES 14nm FinFET技术制造的谐振鳍式晶体管(RFT),利用FinFET的垂直3D几何形状(图21.3.1)有效地限制,驱动和感应固体中的声振动(未发布) CMOS堆栈,无后处理或定制包装。我们演示了Q〜49,000的32GHz谐振器。

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