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Power aware FinFET and lateral nanosheet FET targeting for 3nm CMOS technology

机译:针对3nm CMOS技术的功率感知FinFET和横向纳米片FET

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In this paper, we show how 5.5 tracks standard cells can be enabled at gate pitch 42 nm and metal pitch 21 nm and achieve 60% active power reduction from the 7nm node. A device downselection methodology driven by power and performance targets is introduced. This method demonstrates that three stacked nanosheets of 20 nm width are competitive with FinFETs made with two fins while relaxing the constraints on layout design rules.
机译:在本文中,我们展示了如何在栅距为42 nm,金属栅距为21 nm的情况下启用5.5跟踪标准单元,并从7nm节点实现60%的有功功率降低。介绍了一种由功耗和性能指标驱动的设备降级选择方法。该方法表明,三个宽20 nm的堆叠纳米片与用两个鳍制成的FinFET具有竞争优势,同时放宽了对布局设计规则的限制。

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