Packaging design for Press-Pack IGBTs is required to protect the die from high application specific mechanically and thermally induced stresses that affect the performance and reliability of the device. Finite Element Method (FEM) simulation is used to derive optimisation surfaces that investigate the trade-offs between die stress, thermal resistance, micro-structure protection and reliability. The results demonstrate how the packaging design can be configured to minimise stresses in the die, but that this compromises thermal performance and reliability. The results presented demonstrate how Dynex can produce application specific Press-Pack IGBT devices optimised for performance and cost.
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