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Synthesis of Ge-Sn alloys by ion implantation and pulsed laser melting: Towards a group IV direct band gap semiconductor

机译:通过离子注入和脉冲激光熔化合成Ge-Sn合金:走向IV组直接带隙半导体

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The GeSn material system is expected to be a direct bandgap group IV semiconductor at a Sn content of 6.5-12 at.%, depending on the level of residual compressive strain in the alloy films [1]. Such Sn concentrations can only be realized by non-equilibrium preparation techniques since the equilibrium solubility of Sn in Ge is around 0.5 at.% at room temperature [2]. In this presentation, the combination of ion implantation and pulsed laser melting (PLM) is demonstrated to be a promising alternative method to molecular beam epitaxy (MBE) and chemical vapour deposition (CVD) techniques to produce highly Sn concentrated alloys with good crystal quality.
机译:预期GESN材料系统是在SN含量为6.5-12的SN含量的直接带隙组IV半导体。\%,取决于合金膜中的残余压缩应变水平[1]。这种Sn浓度只能通过非平衡制备技术实现,因为GE中Sn的平衡溶解度为约0.5at。\%在室温下[2]。在该介绍中,对离子注入和脉冲激光熔化(PLM)的组合被证明是对分子束外延(MBE)和化学气相沉积(CVD)技术的有前途的替代方法,以产生具有良好晶体质量的高度Sn浓缩合金。

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