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Impact of substrate on the frequency behavior of trans-conductance in ultrathin body and BOX FDSOI MOS devices - a physical insight

机译:基板对超薄机身和BOX FDSOI MOS器件中跨导频率特性的影响-物理见解

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The continuous reduction in the thickness of body and BOX of FDSOI MOS devices (to sustain scaling) have resulted in increased coupling between the top-gate and substrate underneath BOX. In this work, we have reported an increase in small signal trans-conductance (g) with increase in frequency because of this coupling. This dependence is modulated by changing the substrate doping and BOX thickness. The physical mechanism responsible for this behavior is explained through measurement on different test structures and detailed device simulation.
机译:FDSOI MOS器件的主体和BOX的厚度不断减小(以保持缩放),导致BOX下方的顶栅和衬底之间的耦合增加。在这项工作中,由于这种耦合,我们报告了小信号跨导(g)随着频率的增加而增加。通过改变衬底掺杂和BOX厚度来调节这种依赖性。通过在不同的测试结构上进行测量以及详细的设备仿真来解释造成这种行为的物理机制。

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