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Generalized model of dielectric breakdown for thick and thin SiO2 and Si3N4 films combining percolation model and constant-ΔE model

机译:SiO2和Si3N4薄膜的介电击穿的通用模型,结合了渗流模型和常数ΔE模型

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To realize accurate prediction of TDDB lifetimes, appropriate extractions of various parameters are indispensable. While the TDDB statistics such as the thickness dependence of Weibull slope seems to be successfully described by the percolation model, it has been revealed in this work that the percolation model is not capable to explain the TDDB statistics of thick SiO and SiN films. To comprehensively describe the TDDB statistics for whole thickness region, we propose the generalized model by combining the percolation model with the constant-ΔE model which we proposed as the TDDB mechanism for thick Si3N4 MIM structures.
机译:为了实现TDDB寿命的准确预测,各种参数的适当提取是必不可少的。虽然渗流模型似乎成功地描述了诸如威布尔斜率的厚度依赖性之类的TDDB统计量,但这项工作表明,渗流模型无法解释厚SiO和SiN膜的TDDB统计量。为了全面描述整个厚度区域的TDDB统计量,我们将渗流模型与我们提出的厚膜Si3N4 MIM结构的TDDB机制相结合,提出了广义模型。

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