Thermal characterization and challenges of advanced interconnects (Invited)

摘要

Technology scaling and driving to high performance have led to more joule heating in both devices and interconnects. Since temperature is one of the most sensitive factors impacting interconnect reliability, this paper focuses on the thermal characteristics of metal lines with different geometries and surroundings to accurately assess local temperature of different circuit designs. The experimental results reported can be used as basic input parameters and calibration baseline for thermal model development and simulations.