Pulse gas delivery mass flow controllers for TSV applications

摘要

Advances in the Through Silicon Via (TSV) process have placed performance demands on gas delivery including higher levels of speed, precision, accuracy and repeatability of critical reactive gases, all driven by demands for high etch rate, increased uniformity, small scallops and better profile control. MKS pulse gas delivery mass flow controllers (Pulse MFCs) have been developed in order to solve these TSV etch challenges. Its mole based pulse gas delivery method provides unprecedented rapid pulse gas delivery performance which reduces the cost of the TSV process.