Comparing to the defect of weakness impact resistance of epoxy resin based electrical conductive adhesives (ECAs), flexible conductive adhesives (FCAs) could be used in flexible device electronic packaging. Carbon nanotubes (CNTs) have good properties, which make them to be ideal fillers. In this study, CNTs were used as one-dimensional conductive scaffolds to construct effective networks among the TPU polymer in ECAs. The electrical conductivity and tensile strength improved with the CNT content increased from 0 to 10.0 wt%. In addition, the resistance only changed a little within a certain strain. Under the same strain, the change of R/R0 for the samples with high CNT content is smaller than that of the samples with low CNT content after first cycle. The development of highly conductive, flexible, and low cost ECAs will allow them to be widely used in flexible electronic devices packaging in the future.
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