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Extending the bounds of performance in E-mode p-channel GaN MOSHFETs

机译:扩展E模式p沟道GaN MOSHFET的性能界限

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An investigation of the distribution of the electric field within a normally-off p-channel heterostructure field-effect transistor in GaN, explains why a high |Vth| requires a reduction of the thickness of oxide and the GaN channel layer. The trade-off between on-current |Ion| and |Vth|, responsible for the poor |ION| in E-mode devices is overcome with an additional cap AlGaN layer that modulates the electric field in itself and the oxide. A record |Ion| of 50-60 mA/mm is achieved with a |Vth| greater than |-2| V in the designed E-mode p-channel MOSHFET, which is more than double that in a conventional device.
机译:对GaN中常关p沟道异质结构场效应晶体管内的电场分布进行的研究,解释了为什么| Vth |较高的原因。需要减小氧化物和GaN沟道层的厚度。电流|离子|之间的权衡和| Vth |,对差的| ION |负责在E模式器件中,采用额外的AlGaN覆盖层可克服该缺陷,该AlGaN层可调制自身和氧化物中的电场。记录|离子| | Vth |达到50-60 mA / mm大于| -2 |设计的E模式p沟道MOSHFET中的V,是传统器件的两倍以上。

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