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Variations in programmed phase defect size and its impact on defect detection signal intensity using at-wavelength inspection system

机译:使用波长检测系统编程的相位缺陷尺寸的变化及其对缺陷检测信号强度的影响

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A programmed phase defect Extreme Ultraviolet (EUV) mask was fabricated and measurement repeatability of the defect size using a scanning probe microscope (SPM) was evaluated. The SPM measurement results indicated that the defect size variation as registered by the measurement repeatability were much smaller than the defect-to-defect variations. It means the defect-to-defect variation in size actually does exist. Some defects were found where their sizes before a multilayer coating (on quartz) were all the same but after the coat their sizes varied quite significantly when observed on the multilayer. This result indicated that it is difficult to estimate the phase defect size on quartz, whereas they can be accurately measured on multilayer. Influences of the defect size variation on defect detection signal intensity (DSI) using an actinic blank inspection (ABI) system were examined; their influences on the wafer printability were also examined. The DSI was strongly correlated with defect depth on the multilayer, and it was also indicated that the ABI can detect small variations in defect sizes. It was also confirmed that the impact of the phase defects on wafer printed CDs were proportional to the DSIs, and that the ABI has a potential to detect phase defect that could cause 5 % of the CD error when printing 16 run dense lines.
机译:制造了编程的相位缺陷极端紫外(EUV)掩模,并评估使用扫描探针显微镜(SPM)的缺陷尺寸的测量可重复性。 SPM测量结果表明,由测量重复性注册的缺陷尺寸变化远小于缺陷缺陷变化。这意味着实际确实存在尺寸的缺陷缺陷变化。在多层涂层(在石英上)之前的尺寸都是相同的,但在涂层后,在多层观察时,在涂层之后,它们的尺寸非常显着变化。该结果表明,难以估计石英上的相位缺陷尺寸,而它们可以在多层上准确地测量它们。研究了使用光化空白检查(ABI)系统的缺陷尺寸变化对缺陷检测信号强度(DSI)的影响;还检查了它们对晶圆可印刷性的影响。 DSI与多层缺陷深度强烈相关,并表示ABI可以检测缺陷尺寸的小变化。还证实,相位缺陷对晶片印刷CD的影响与DSI具有成比例,并且ABI具有检测在打印16次运行致密线时可能导致5%CD误差的相缺陷的可能性。

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