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Filling the terahertz gap with sand: High-power terahertz radiators in silicon

机译:用沙子填充太赫兹间隙:硅中的大功率太赫兹辐射器

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This paper reviews our recent work on Si and SiGe THz sources that generate high-power coherent radiation. Our design approach blends the optimization of device operation near or above f with unconventional circuit topologies and energy-efficient electromagnetic structures. Using a 130-nm SiGe HBT process (f=3D280 GHz), our 320-GHz transmitter produces a record radiated power (3.3 mW) and DC-to-THz radiation efficiency (0.54%) among all THz signal sources in silicon. This transmitter also demonstrates fully-integrated phase-locking capability for THz radiators for the first time. In this paper, a 260-GHz pulse radiator and a 340-GHz phased array, which are based on a 65-nm bulk CMOS process, are also presented. The former generates a radiated power of 1.1 mW, and provides THz pulses with 25-GHz bandwidth. The latter generates a radiated power of 0.8 mW and has a 50 beam-steering capability. These works demonstrate a promising roadmap towards future THz microsystems using silicon integrated-circuit technologies.
机译:本文回顾了我们最近在产生高功率相干辐射的Si和SiGe THz光源方面的工作。我们的设计方法将接近或高于f的器件操作优化与非常规的电路拓扑和节能的电磁结构融为一体。我们的320 GHz发送器使用130 nm SiGe HBT工艺(f = 3D280 GHz),在硅中所有THz信号源中产生了创纪录的辐射功率(3.3 mW)和DC-THz辐射效率(0.54%)。该发射器还首次展示了针对THz辐射器的完全集成的锁相功能。本文还介绍了基于65 nm体CMOS工艺的260 GHz脉冲辐射器和340 GHz相控阵列。前者产生的辐射功率为1.1 mW,并提供25 GHz带宽的THz脉冲。后者产生的辐射功率为0.8 mW,光束转向能力为50。这些工作展示了使用硅集成电路技术向未来太赫兹微系统发展的有前途的路线图。

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