A DIFFERENT PERSPECTIVE ON SOLDER PASTE PRINTING: PERFECTING THE PRINT PROCESS WITH PRACTICAL SOLUTIONS

摘要

The rapid growth of electronic devices across the globe is driving manufacturers to enhance high-speed mass production techniques in the printed circuit board assembly arena. As manufacturers drive to reduce costs while maximizing production by expanding facilities, updating automation equipment, or implementing lean six sigma techniques, the potential to build scrap product or rework PCBs increases dramatically. Manufacturers have two general paths to reduce the costs of high-speed printed circuit board assembly production. The first path is to reduce cost by focusing on high quality printing and mounting. The other, increasingly popular option is to utilize low-cost materials. In either case, the baseline must provide a consistent high-speed solder paste printing method, which considers the fill, snap-off, and cleaning processes. Building on our expertise and testing, this paper will highlight the two trains of thought with specific focus on how low-cost materials affect print performance. It will also explore technologies, which can help provide stable, high-speed screen-printing. In the end, both paths aim to maximize profitability. As such, understanding how manufacturers can successfully integrate low-cost materials will help ensure high-quality production, reduce costs, and maximize profitability in a high-volume printed circuit board assembly environment.