A LOWER TEMPERATURE SOLDER JOINT ENCAPSULANT FOR SN/BI APPLICATIONS

摘要

The electronic industry is currently very interested in low temperature soldering processes such as using Sn/Bi alloy to improve process yield, eliminate the head-in-pillow effect, and enhance rework yield. However, Sn/Bi alloy is not strong enough to replace lead-free (SAC) and eutectic Sn/Pb alloys in most applications. In order to improve the strength of Sn/Bi solder joints, enhance mechanical performance, and improve reliability properties such as thermal cycling performance of soldered electronic devices, YINCAE has developed a series of low temperature solderable adhesives using solder joint encapsulant which can be used for Sn/Bi soldering applications. These low temperature solderable adhesives can be dipped, dispensed, or printed. After reflow solder joint encapsulant encapsulates the solder joint, as a result, the strength of solder joints is enhanced by several times, and thermal cycling performance is significantly improved. All details will be discussed in this paper.