首页> 外文会议>IEEE International Symposium on Nanoelectronic and Information Systems >Performance Analysis of AsF5-intercalated Top-Contact Multi Layer Graphene NanoRibbon Interconnects
【24h】

Performance Analysis of AsF5-intercalated Top-Contact Multi Layer Graphene NanoRibbon Interconnects

机译:ASF5嵌入式顶触多层石墨烯纳米粘连互连性能分析

获取原文

摘要

In this paper, As F5-intercalated multilayer graphene nanoribbons (MLGNRs) as a potential interconnect candidate for future technology nodes is investigated. This paper for the first time analyzes impact of As F5 intercalation on effective resistance of top contact MLGNR (TC-MLGNRs) interconnects. Performance metrics such as delay, energy delay product and bandwidth density of As F5-intercalated TC-MLGNRs for local/intermediate and global interconnects are analyzed and compared with that of neutral TC-MLGNRs as well as traditional copper (Cu) interconnects. Our analysis shows that for similar dimensions, As F5-intercalated TC-MLGNR interconnects can provide better performance than Cu wires for both local/intermediate and global interconnect applications. For 1 mm interconnect length, As F5-intercalated TC-MLGNRs offer significant improvement in delay, energy budget and BWD as compared to Cu wires for local/intermediate and global interconnects, thereby making it a promising candidate for future interconnect technologies.
机译:本文研究了作为未来技术节点的潜在互连候选者的F5层内石墨烯纳米杆(MLGNR)。本文首次分析了作为F5嵌入对顶部触点MLGNR(TC-MLGNRS)互连的有效电阻的影响。分析了诸如延迟,能量延迟产品和带宽密度的性能度量,作为局部/中间和全局互连的F5插入的TC-MLGNRS,与中性TC-MLGNRS以及传统铜(Cu)互连进行比较。我们的分析表明,对于类似的尺寸,随着F5插入的TC-MLGNR互连可以提供比局部/中间和全局互连应用的Cu线的更好的性能。对于1毫米互连长度,与局部/中间和全局互连的Cu电线相比,F5插入的TC-MLGNRs提供延迟,能量预算和BWD的显着改善,从而使其成为未来互连技术的有希望的候选者。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号