首页> 外文会议>International Symposium on VLSI Technology, Systems and Applications >Relaxed Ge0.97Sn0.03 P-channel tunneling FETs with high drive current fabricated on Si and further improvement enabled by uniaxial tensile strain
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Relaxed Ge0.97Sn0.03 P-channel tunneling FETs with high drive current fabricated on Si and further improvement enabled by uniaxial tensile strain

机译:在Si上制造具有高驱动电流的弛豫Ge 0.97 Sn 0.03 P沟道隧穿FET,并通过单轴拉伸应变实现进一步改进

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摘要

We fabricated relaxed GeSn pTFETs on Si(001). The devices show much higher I than SiGe, Ge, and compressively strained GeSn planer pTFETs in literatures. For the first time, I enhancement in GeSn pTFET utilizing uniaxial strain is reported. By applying 0.14% uniaxial tensile strain along channel direction, GeSn [110] pTFETs achieve ~ 10% I improvement, over relaxed devices at |V - V| = |V| = 1.0 V. Calculation demonstrates that the reduction of direct E by tensile strain results in an enhanced G in GeSn, leading to improvement of I in uniaxially tensile strained pTFET.
机译:我们在Si(001)上制造了弛豫的GeSn pTFET。在文献中,该器件的I远远高于SiGe,Ge和受压应变的GeSn平面pTFET。首次报道了利用单轴应变增强GeSn pTFET的I。通过沿沟道方向施加0.14%的单轴拉伸应变,GeSn [110] pTFET在| V-V |的情况下比松弛的器件可提高〜10%的I。 = | V | = 1.0V。计算表明,通过拉伸应变降低直接E会导致GeSn中的G增强,从而导致单轴拉伸应变pTFET中的I得以改善。

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