Generic InP-based Integration Technology: RF Crosstalk in High-capacity Optical Transmitter PICs

摘要

This paper reviews the basic ideas behind generic photonic integration and outlines how high-capacity integrated optical transmitters can benefit from this approach. Measurements of electrical coupling effects in a packaged transmitter chip are given, showing 2 dB power penalty due to RF crosstalk. A suitable simulation method for analyzing coupling effects on the integrated chip is presented and used to investigate the crosstalk originating from on-chip electrical routing lines and electro-optical phase shifters.