Advances in 3D Heterogeneous Structures and Integration for Future ICs (Invited)

摘要

This paper reviews recent advances in developing 3D heterogeneous structures and integration technologies for future integrated circuits (IC) addressing the challenges related to the Moore's Law. Novel 3D heterogeneous structures, including nano crossbar phase-switching and graphene NEMS electrostatic discharge (ESD) protection devices, compact vertical inductors with stacked-via magnetic cores, in backend-of-line (BEOL) crosstalk isolation structures, and multi-gate transistors, are presented as enablers for future smart chips.