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Carbon implantation performance improvement by using carbon monoxide (CO) gas on applied materials VIISta HCS implanter

机译:通过在应用材料上使用一氧化碳(CO)气体来改善碳注入性能VIISta HCS注入机

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Carbon implant has become one of the major co-implant steps in the fabrication of advanced semiconductor devices due to its proven effectiveness in controlling and reducing Transient Enhanced Diffusion (TED) in ultra-shallow junction formation. Carbon dioxide (CO) is still widely used as the feed gas for carbon implantation. However, it is well known that the high concentration of oxygen from CO causes many problems, including oxidation of the implant arc chamber components, which leads to rapid performance degradation of the source. Phosphine (PH) is often used as a dilution gas to minimize the oxidation effect from CO. However, its use usually results in a reduction of the C beam current, thereby negatively impacting the tool's productivity. In this paper, carbon monoxide (CO) is presented as an alternative carbon doping gas replacing CO or CO with PH dilution (referred to as CO/PH throughout this paper). CO is shown to exhibit distinct performance improvements compared to CO/PH on the Applied Materials VIISta HCS high current implanter. Significant improvement in C beam current and source life with CO gas is noted.
机译:碳植入物已经被证明是控制和减少超浅结形成中的瞬态增强扩散(TED)的有效手段,因此已成为先进半导体器件制造中主要的共植入步骤之一。二氧化碳(CO)仍被广泛用作碳注入的原料气。然而,众所周知,来自CO的高浓度氧气引起许多问题,包括植入电弧室部件的氧化,这导致源的快速性能下降。磷化氢(PH)通常用作稀释气体,以最大程度地减少来自CO的氧化作用。但是,磷化氢的使用通常会导致C束电流降低,从而对工具的生产率产生负面影响。在本文中,一氧化碳(CO)作为替代性的碳掺杂气体被提出,代替了用PH稀释的CO或CO(在整个本文中称为CO / PH)。与应用材料VIISta HCS大电流注入机上的CO / PH相比,CO表现出明显的性能提升。注意到使用CO气体可显着改善C束电流和源寿命。

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