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Silicon microneedles for transdermal applications by electrochemical micromachining technology

机译:通过电化学微加工技术用于经皮应用的硅微针

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We report a novel, versatile, and low-cost approach for fabrication of out-of-plane silicon microneedles for transdermal applications. Unlike state-of-the-art microneedles reported so far, the microneedles of this work feature a built-in reservoir in each single needle-core to be used in future applications for drug storing and delivery after insertion in the skin. The microneedles, with size up to ten times thinner than a human hair, height of about 100 µm, and density of 10000 needles/cm (spatial period 100 µm) are effectively fabricated by silicon electrochemical micromachining (ECM) technology. In-vitro insertion tests, which are carried out on synthetic skins made out of alginate hydrogels with different concentrations, clearly demonstrate penetration reliability of such tiny needles.
机译:我们报告了一种新颖,通用且低成本的方法,用于制造用于透皮应用的面外硅微针。与迄今为止报道的最先进的微针不同,这项工作的微针在每个单针芯中都有一个内置的储存器,可在将来的应用中用于插入皮肤后进行药物存储和输送。通过硅电化学微加工(ECM)技术可以有效地制造尺寸比人的头发细十倍,高度约100 µm,密度为10000针/ cm(空间周期为100 µm)的微针。在由不同浓度藻酸盐水凝胶制成的合成皮肤上进行的体外插入测试清楚地证明了这种细小针头的穿透可靠性。

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