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New findings on the scattering mechanisms in inversion layers of Ge (111), (110), and (100) nMOSFETs under high electric field—Differences with Si nMOSFETs

机译:高电场下Ge(111),(110)和(100)nMOSFET的反型层中散射机制的新发现-与Si nMOSFET的差异

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We have, for the first time, confirmed that in Ge nMOSFETs the dominant scattering mechanism in the high-field region is not necessarily the surface roughness scattering. We found that, in Ge(100) nMOSFETs, because the phonon scattering is still dominant in the high-field region, it is difficult to enhance the high-field mobility by controlling the interface roughness. Since Ge(111) and Ge(110) nMOSFETs are free of the intervalley phonon scattering, the high-field mobility could be enhanced by the Ge interface engineering. Furthermore, different from that in Si nMOSFETs, surface roughness scattering in Ge nMOSFETs shows a strong temperature dependence.
机译:我们首次确认,在Ge nMOSFET中,高场区的主要散射机制不一定是表面粗糙度散射。我们发现,在Ge(100)nMOSFET中,由于声子散射仍在高场区域占主导地位,因此难以通过控制界面粗糙度来增强高场迁移率。由于Ge(111)和Ge(110)nMOSFET不具有音素声子散射,因此可以通过Ge界面工程来增强高场迁移率。此外,与Si nMOSFET的情况不同,Ge nMOSFET的表面粗糙度散射表现出强烈的温度依赖性。

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