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Comparison of Different Scattering Mechanisms in the Ge (111), (110), and (100) Inversion Layers of nMOSFETs With Si nMOSFETs Under High Normal Electric Fields

机译:高标准电场下具有Si nMOSFET的nMOSFET的Ge(111),(110)和(100)反转层中不同散射机制的比较

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摘要

In this paper, we report, for the first time, that surface roughness scattering is not necessarily the dominant scattering mechanism in the high-normal-field region of Ge nMOSFETs. This statement is quite different from the well-recognized situation in Si MOSFETs. In Ge(100), phonon scattering is dominant in the high-field region. Thus, it is difficult to increase the high-normal-field mobility in Ge(100) nMOSFETs by controlling the interface roughness. In contrast, because Ge(111) and Ge(110) are free of intervalley phonon scattering, the high-field mobility in Ge(111) and Ge(110) nMOSFETs could be enhanced by the Ge interface engineering. Furthermore, different from that in Si nMOSFETs, mobility limited by surface roughness scattering in Ge nMOSFETs shows a strong temperature dependence due to the valley occupancy change of electrons. The results in this paper should facilitate efforts to increase the high-normal-field mobility in Ge nMOSFETs.
机译:在本文中,我们首次报道了表面粗糙度散射不一定是Ge nMOSFET高正场区的主要散射机制。这一说法与公认的Si MOSFET情况大不相同。在Ge(100)中,声子散射在高场区域占主导地位。因此,很难通过控制界面粗糙度来增加Ge(100)nMOSFET中的高法向场迁移率。相比之下,由于Ge(111)和Ge(110)没有音素声子散射,因此Ge(111)和Ge(110)nMOSFET的高场迁移率可以通过Ge界面工程来增强。此外,与Si nMOSFET的情况不同,由于电子的谷占有率变化,Ge nMOSFET的受表面粗糙度散射限制的迁移率显示出强烈的温度依赖性。本文的结果应有助于增加Ge nMOSFET的高法向场迁移率。

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