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Methodical Design Approaches to Radiation Effects Analysis and Mitigation in Flip-Flop Circuits

机译:触发器电路中辐射效应分析和缓解的方法设计方法

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With transistor dimensions shrinking due to continued scaling, integrated circuits are increasingly susceptible to radiation upset. This paper presents a systematic methodology for evaluating circuit hardness, as well as graph clustering approaches to determine effective node separation to protect against upset due to multiple node charge collection. The methodology is circuit simulation based, making it efficient and usable by circuit designers. Example designs are presented to demonstrate the analysis and clustering for real flip-flop designs. Finally, the methodology is utilized to provide critical node separation for a new hardened flip-flop design that reduces the power and area by 27% and 19.5% respectively.
机译:随着晶体管尺寸的不断缩小,集成电路越来越容易受到辐射干扰的影响。本文提出了一种用于评估电路硬度的系统方法,以及一种图形聚类方法来确定有效的节点分离,以防止由于多节点电荷收集而引起的混乱。该方法是基于电路仿真的,因此电路设计人员可以高效地使用它。给出了示例设计,以演示实际触发器设计的分析和聚类。最后,该方法用于为新的硬化触发器设计提供关键节点分离,该设计将功耗和面积分别减少了27%和19.5%。

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