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Maximizing reliable performance of advanced CMOS circuits#x2014;A case study

机译:最大限度地提高先进CMOS电路的可靠性能-案例研究

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We consider in detail the aspects of maximizing application performance while maintaining its sufficient reliability on the specific case of serially connected nFETs. Serially connected nFETs used in some digital CMOS applications, such as SRAM decoder circuits, and dynamic logic, are vulnerable to Positive Bias Temperature Instability (PBTI). Here we discuss the impact of PBTI frequency and workload on high-k/metal gate nFETs in terms of Capture and Emission Time (CET) maps and quantitatively explain the degradation of our test circuit. This constitutes one of the first validations of the CET map-based methodology on a real silicon circuit. From individual trapping events in deeply scaled nFETs we then project PBTI distributions at 10 years. We further show that at increased supply voltage the serially connected nFET speed degradation is outweighed by signal transfer speedup, resulting in a net performance improvement. Finally, we discuss other degradation mechanisms and conclude the reliability in the studied case will be limited by hard gate oxide breakdown.
机译:我们详细考虑了在串联nFET的特定情况下保持其足够的可靠性的同时,最大化应用性能的各个方面。某些数字CMOS应用(例如SRAM解码器电路和动态逻辑)中使用的串联nFET容易受到正偏置温度不稳定性(PBTI)的影响。在这里,我们根据捕获和发射时间(CET)图来讨论PBTI频率和工作负载对高k /金属栅极nFET的影响,并定量解释测试电路的性能下降。这构成了在真实硅电路上基于CET图的方法论的首批验证之一。从深度扩展的nFET中的单个陷获事件,我们可以预测10年后的PBTI分布。我们进一步表明,在电源电压增加的情况下,串联的nFET速度下降的幅度超过了信号传输的加速幅度,从而导致了净性能的提高。最后,我们讨论了其他退化机制,并得出结论,在所研究的情况下,可靠性将受到硬栅氧化层击穿的限制。

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