Integrated microfluidic cooling of high power passive and active devices on multilayer organic substrate

摘要

This paper presents a microfluidic cooling solution for passive and active devices on liquid crystal polymer (LCP). Distilled (DI) water circulates inside a 15 mil micromachined channel and takes away the dissipated heat from passive and active heat sources. A micropump is used to provide enough pressure to inject the fluid and to ensure its circulation. A 20 W surface mount resistor is cooled with moving DI water and operated at 12.3 W at 25 °C, while this device can only dissipate 7 W at 25 °C if the DI water is static. A 5 W discrete power gallium arsenide (GaAs) die is attached to the microfluidic channel and cooled to operate at 3.45 W at 60 °C under DC operation.