In this paper, the method of Lock-in Thermography is presented which is an enhanced Thermography method leading to high spatial resolution (～1μm) and high sensitivity (single μW). Thus, the method enables thermal investigations for fault isolation (e.g. electrical shorts) on power devices. Based on case studies, the operational principle and the advantages for non-destructive defect localization are shown. These case studies include the possibility of detecting electrical active defects buried under metal layer and in close distance to bond wires as well as the prediction of break-down positions. As a second key aspect, the method of thermal trigger delay is introduced and applied for high temporal thermal imaging of fast thermal events such as investigations focused on device switching characteristics.
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