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Fabrication of double-sided micro structured mechanical sensors based on SU-8 resist using a new micro molding process

机译:基于SU-8抗蚀剂的双面微结构机械传感器使用新的微模制工艺制造

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Advances in micro and nano fabrication technologies for MEMS require high-level measurement techniques with regard to sampling and sensitivity. For this purpose at the Institute of Microtechnology (IMT) highly sensitive piezoresistive 3D force sensors based on SU-8 polymer have been developed. In this paper we present an improved micro fabrication process for a double-sided micro structured design. The sensors are produced by multilayer processing techniques such as UV lithography and coating methods. The double-sided micro structured design demands a photoresist application method which simultaneously features a top side structuring and a casting from a mold. We use a new micro molding process to meet the demands. The micro fabrication technology is described, focusing on the development of the molding structure for shaping of the bottom side and a capable release process for the detachment of the molded structures. The fabrication process of the SU-8 mold layer is optimized to fabricate molding structures with heights from a few urn up to 350 μm Therefore different SU-8 formulations, namely with classification numbers 5, 25, 50, and 100, have been used. The fundamental limitations for the mold design result from the lithography process, which defines the smallest lateral resolution, and from the characteristics of a molding process, e. g. the impossibility to realize an undercut. To allow for reliable release, the molding structures have to be coated with a sacrificial layer. A silicon nitride is deposited onto the substrate with an accompanying monitoring of the deposition temperature during the PECVD process.
机译:MEMS的微型和纳米制造技术的进步需要关于采样和灵敏度的高电平测量技术。为此目的,在微技术研究所(IMT)基于SU-8聚合物的高敏感压阻式3D力传感器已经开发出来。在本文中,我们为双面微结构化设计提供了一种改进的微制造工艺。传感器由多层加工技术(如UV光刻和涂料)制成。双面微结构设计要求光致抗蚀剂应用方法,其同时具有顶侧结构和从模具的铸造。我们使用新的微型模塑过程来满足需求。描述了微制造技术,其专注于形成用于成形的底侧的模制结构和用于脱离模制结构的能力释放过程。 SU-8模具层的制造过程经过优化,以制造具有高达350μm的高度,因此不同的SU-8配方的高度,即使用分级5,25,50和100。模具设计的基本限制由光刻工艺产生的,它限定了最小的横向分辨率,以及从模塑过程的特性,e。 G。不可能实现底切。为了允许可靠的释放,必须将模塑结构涂覆有牺牲层。在PECVD工艺期间伴随着沉积温度的沉积温度沉积氮化硅沉积到基板上。

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