A flexible experimental workcell for efficient and reliable wafer-level 3D microassembly

摘要

This paper reports on an experimental microassembly workcell developed for efficient and reliable 3D assembly of large numbers of micromachined thin metal parts into micromachined holes in 4 inch silicon wafers. The major objective is to integrate techniques of microgripper design, microscopic imaging and high precision motion control to build a prototype system for industrial applications. The workcell consists of a multiple-view imaging system, a 4 DOF micromanipulator with high resolution rotation control, a large working space 4 DOF precision positioning system, a flexible microgripper, and control software system. A piezoelectric force sensing unit is developed to be integrated with the manipulator system to enhance pickup reliability. Operations are partially guided by a human operator through a graphical user interface (GUI). This system provides a highly flexible testbed for wafer-level 3D microassembly.