Direct liquid cooling technology of IGBT (Insulated Gate Bipolar Transistor) modules is one of the most efficient method to achieve high power density and good thermal performance.Direct liquid cooling IGBT module,which has copper base with square pin fin and silicon nitride (Si3N4) insulated substrate with newly developed solder,has been developed.For the purpose of achieving high performance and high reliability of IGBT modules for automotive application,it is important to optimize peripheral components such as cooling liquid jacket and Nickel (Ni) plating for copper pin fin base.In this paper,cooling liquid jacket structure has been optimized and reliability of Ni plating for copper fin base has been studied.Direct liquid cooling technologies can help high performances for EV (Electric vehicle) and HEV (Hybrid Electric Vehicle).
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