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Peculiarities of substrate mass loss under micron pulse laser direct structuring

机译:微米脉冲激光直接结构化过程中基质质量损失的特殊性

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In this paper, we discuss the issues relevant for the laser-machining process, including the precision and the material removal rate. We have investigated a surface morphology and a mass loss of technical rubber and plastic, industrial silicon and stainless steel ribbon after irradiation by microsecond laser pulses at different pulse energies, repetition rate and irradiation strategies. Laser milling with microsecond pulses (~ 10~(-5)-10~(-6) s) is a thermal material removal process usually associated with detrimental effects such as heat affected zones, a recast layer and debris. It was shown, that process optimization can lead to considerable reduction of the above mentioned negative effects. The mass removal rates are analyzed depending on environment conditions and laser influence regimes. At the optimum operation parameters, have demonstrated that the experimental mass lost is significantly different from the theoretical estimations and this demands a future model improvement.
机译:在本文中,我们讨论了与激光加工过程相关的问题,包括精度和材料去除率。我们研究了微秒激光脉冲在不同脉冲能量,重复频率和辐照策略下辐照后,工业橡胶和塑料,工业硅和不锈钢带的表面形态和质量损失。微秒脉冲(〜10〜(-5)-10〜(-6)s)的激光铣削是一种热材料去除过程,通常与有害影响相关,例如热影响区,重铸层和碎屑。结果表明,工艺优化可以大大减少上述负面影响。根据环境条件和激光影响范围来分析质量去除率。在最佳操作参数下,已证明实验损失的质量与理论估计值明显不同,这需要未来的模型改进。

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