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Effect of Alterative and Homogenization on the Microstructure of Cu-20Ni-5Sn Alloy

机译:交替同质化对Cu-20Ni-5Sn合金组织的影响

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The serious dendritic segregation occurs in Cu-20Ni-5Sn alloy. The microstructure of Cu-20Ni-5Sn alloy as-cast is composed of white light dendrite (Cu-Ni solid solution), Sn-rich solid solution (Cu_2Ni_3Sn_3 phase) and block light precipitation (Ni_(17)Sn_3 phase). The microstructure of Cu-20Ni-5Sn alloy affected by alterative and homogenization temperature was studied. The results show that the alterative can refine the microstructures of the Cu-20Ni-5Sn alloy and reduce the segregation of Sn. The grains are quite fine with 0.9%Wt alterative in the alloy. The homogenization temperature of the Cu-20Ni-5Sn alloy decreases with increase of alterative content in the alloy. Grains enlarged with the increase of homogenization temperature, and the secondary phase distributes became more evenly. The optimization condition of homogenization treatment is at 800°C in 24h.
机译:Cu-20Ni-5Sn合金中发生严重的枝晶偏析。铸态的Cu-20Ni-5Sn合金的显微组织由白光枝晶(Cu-Ni固溶体),富锡固溶体(Cu_2Ni_3Sn_3相)和阻挡光沉淀(Ni_(17)Sn_3相)组成。研究了变化和均质温度对Cu-20Ni-5Sn合金组织的影响。结果表明,该替代物可以改善Cu-20Ni-5Sn合金的组织,减少Sn的偏析。晶粒非常细,合金中Wt的变化为0.9%。 Cu-20Ni-5Sn合金的均质温度随合金中替代含量的增加而降低。随着均质温度的升高,晶粒增大,第二相的分布变得更加均匀。均质处理的最佳条件是在24小时内在800°C下进行。

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