A 300mm semiconductor fab requires a tremendous amount of investment with a great deal of process tools inside. Those process tools are connected by the automatic material handling system (AMHS), thus requiring an extremely complex AMHS network. Additionally, unlike simple products of an integrated device manufacturer (IDM) or a memory fab, foundry fab manufactures hundreds of consumer products simultaneously, subsequently creating globally an extremely high transportation volume and complex demands on the material handling system. Previously, experiential engineers designed AMHS, possibly taking months of design lead-time. However, the next generation fab AMHS design focuses not only AMHS specifications, but also operational know-how. Meanwhile, a long design lead time fails to fulfill the requirements of the fast ramp up plan. Additionally, design optimization and shrink lead time are achieved by applying simulation modeling as a design platform whenever TSMC constructs an AMHS for a new fab. Via this platform, precise simulation is performed on the AMHS specifications, fab layout, tool configuration, and process flow information to ensure design success and avoid a potential AMHS bottleneck.
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