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Energy efficiency comparison of nanowire heterojunction TFET and Si MOSFET at Lg#x003D;13nm, including P-TFET and variation considerations

机译:纳米线异质结TFET和Si MOSFET在Lg = 13nm时的能效比较,包括P-TFET和变化注意事项

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摘要

Reducing supply voltage (Vdd) while keeping leakage current low is critical for minimizing energy consumption and improving mobile device battery life. The thermal limit of MOSFET subthreshold slope (SS) restricts lowering threshold voltage (Vt), causing significant performance degradation at low Vdd. A Tunneling Field Effect Transistor (TFET) is not limited by this thermal tail and may perform better at low Vdd [1,2]. In this paper, a leading N-TFET option - GaSb/InAs heterojunction - is atomistically modeled [3,4] and circuit simulation models are developed to predict 64% average energy savings against Si CMOS at Lg=13nm for a nanowire. Energy savings diminish to 21% without a good P-TFET option. Both MOSFET and TFET device variations are dominated by work-function variation, and TFET energy savings are slightly reduced when variations are considered.
机译:降低电源电压(V dd )并保持较低的泄漏电流对于最大限度地降低能耗和延长移动设备的电池寿命至关重要。 MOSFET亚阈值斜率(SS)的热极限限制了阈值电压(V t )的降低,从而在低V dd 时导致明显的性能下降。隧穿场效应晶体管(TFET)不受此热尾的限制,并且在低V dd 的情况下可能会表现更好[1,2]。在本文中,采用原子模型[3,4]对领先的N-TFET选项GaSb / InAs异质结进行了建模,并开发了电路仿真模型以预测纳米线在Lg = 13nm时与Si CMOS相比平均节能64%。如果没有良好的P-TFET选项,节能量将减少至21%。 MOSFET和TFET器件的变化都以功函数变化为主导,考虑变化时,TFET的节能量会略有减少。

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