A Highly Reliable Single-Crystal Silicon RF-MEMS Switch Using Au Sub-micron Particles for Wafer Level LTCC Cap Packaging

摘要

This paper presents a small packaged, reliable and low-voltage driven RF-MEMS switch for wireless communication. We developed novel fabrication process of an RF-MEMS switch using a PZT actuator without a backside cavity to realize wafer-level-packaging (WLP). We also developed organic-free WLP process using sub-micron Au particles simultaneously to contact electrically and to seal hermetically with a low temperature co-fired ceramics (LTCC) wafer as a cap on a multilevel height RF switch. As a result, we obtained a small packaged SPST switch, which is in the small size of 1.4 x 0.9 x 0.8 mm. The RF-MEMS switch operated keeping a low contact resistance (<3 ?) up to 1 billion cycles at a low-power condition (DC 1 mW).