This paper describes the design of mushroom EBG (Electromagnetic Band Gap) structure within slit defected on power supply plane in order to control PI (power integrity) for realizing high-density multi-stacked printed circuit board. Generally, EBG structure is not suitable to block the low frequency noise around lGHz in the printed circuit board, because EBG structure requires large area to cutoff low frequency noise. In this paper, new type of mushroom EBG structure, which has slit defect on power supply plane, to increase inductance for EBG function was proposed. By applying the new mushroom EBG structure of small patch size 10mm x 10mm x 3 pieces in the 0.9 mm thickness printed circuit board, we realized -40dB isolation at stop band frequency 0.94GHz~1.25GHz. Consequentially, the multi-stacked printed circuit board thickness could be reduced to 81% of using conventional mushroom EBG structure.
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机译：本文介绍了在电源平面上截取的狭缝内的蘑菇EBG（电磁带隙）结构的设计，以控制PI（功率完整性）来实现高密度多堆叠印刷电路板。 通常，EBG结构不适合阻止印刷电路板中LGHz周围的低频噪声，因为EBG结构需要大面积以截止低频噪声。 本文提出了新型的电源平面上具有狭缝缺陷的蘑菇EBG结构，以增加EBG功能的电感。 通过应用新的蘑菇eBG结构的小贴片尺寸10mm x 10mm x 3件在0.9 mm厚度印刷电路板中，我们在停止带频率下实现-40dB隔离0.94GHz〜1.25GHz。 因此，多堆叠的印刷电路板厚度可以减少到使用传统蘑菇EBG结构的81％。
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