An Analysis of the Thermal Efficiency of Different Heat Sinking Solutions by High Accuracy Measurements of the Laser Die Temperature of a High Density Optical Engine

摘要

The thermal management of high-bandwidth and power-dense packaged devices and the assessment of their cooling efficiency is a complex design and measurement challenge. Both the individual active components and the external cooling system must be carefully considered and optimised as part of the overall package. In the presented application of optical transceiver assemblies, integrated heat sinks are a key thermal solution that leads to improvements in performance and component lifetime. We demonstrate use of the spectral change in multimode lasers to non-destructively and precisely measure the thermal resistance from individual VCSEL channel to package for several integrated heat sink variations.