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Built-in IDDT appearance time sensor for detecting open faults in 3D IC

机译：内置IDDT出现时间传感器，用于检测3D IC中的开路故障

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摘要

A built-in sensor is proposed for detecting open faults in a 3D IC by means of appearance time of dynamic supply current. It is shown by Spice simulation that they can be detected with the sensor.

机译：提出了一种内置传感器，用于通过动态电源电流的出现时间来检测3D IC中的开路故障。 Spice仿真显示可以使用传感器检测到它们。

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《IEEE CPMT Symposium Japan》|2013年|1-4|共4页
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作者
Suenaga Shohei; Hashizume Masaki; Yotsuyanagi Hiroyuki; Tada Tetsuo;
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关键词
3D IC; BIST; IDDT testing;

机译：3D IC; BIST; IDDT测试;

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Built-in IDDT appearance time sensor for detecting open faults in 3D IC

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